The all new ultra-low cost PILOT machine has been designed as an entry level, hand load, bench-top machine for small to medium batch manufacturers combining high levels of production flexibility with economic running costs.

Offered with two universal, quick change tooling carriers, each one can be exchanged to optimize cycle time. Each carrier is capable of handling a board size up to 330mm x 250mm.

The PILOT incorporates as standard, our patented Drop-Jet fluxer for quick, accurate flux deposition. An optional bottom-side IR preheat is also available, this is particularly useful when processing multi-layer PCB’s or using water based flux types.

Although a low cost system, the PILOT is offered with the ability to run the acclaimed highly flexible Pillarhouse AP nozzle technology, together with our patented market leading 1.5mm micro nozzle. The process is enhanced by a localized hot Nitrogen environment at the point of soldering. An optional Nitrogen generator is built into the base of the unit and can be used to supply Nitrogen at the required levels, whilst acting as a machine stand.

Designed for low maintenance, the PILOT offers a slide in/out solder bath design for ease of access. This in conjunction with our proven impellor driven pump technology, makes a highly reliable low maintenance system.

By carrying product over the flux, solder and optional preheat stations, the PILOT offers a light, highly accurate X, Y system.

Programming is accessed through the world leading Pillarhouse ‘Point and Click’ PillarCOMM software package. Optional offline programming is available via PillarPAD which allows programs to be generated independently from the machine using Gerber data.

Standard Features

• Machine mounted TFT monitor with integral PC
• Inerted Nitrogen system
• Drop-Jet fluxer
• One AP style solder nozzle tips
• Internal fume extraction
• PillarPAD offline programming system
• Colour programming camera
• Two universally adjustable tooling carriers
• PillarCOMM LITE – Windows® based ‘Point & Click’ interface
• Solder wave height measurement & correction
• Lead-free compatible
• Day-to-day service kit

System Options

• Fume filtration system
• Manual fiducial correction
• Micro nozzle assembly
• Multiple level password protection
• Bottom-side preheater
• Combined Nitrogen generator & machine stand

P/N 62216

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• Allows easy creation of flux, preheat and solder joints and paths.
• Produces Graphical representations of the PCB.
• Solder nozzles shown as actual size.
• Uses industry standard Gerber Data.
• 90% of the programming of a new board to be done away from the production line.

PillarPAD is the Windows® based Off-line Programming system for the Pillarhouse International range of Selective Soldering Systems. It provides a user-friendly interface to allow the User to produce Process Programs away from the Production line. This results in reduced downtime for the production line when configuring for a new product.

PillarPAD is a two-part software package:

PillarPAD Import

• The pre-processor part of the package.
• Interprets Gerber data and populates the process database with data to produce the graphical image.
• Reads Gerber RS274 and RS274X formats.
• Imports separate apertures lists with a semi-intelligent import wizard.

PillarPAD Draw

• The process design part of the package.
• Produces Graphical representations of the PCB.
• Allows setting of Program Header data.
• Allows easy creation of flux, preheat and solder joints and paths.
• Solder nozzles shown as actual size.
• The PillarPAD software package creates a single data file that can then be transferred to the required Selective Soldering System(s). One process program can be used on multiple Soldering Systems.

PillarPAD is available in two licensed formats

• Software locked. This allows PillarPAD to be installed and run on a single PC. This is a non-transferable license.
• Hardware locked. This allows PillarPAD to be installed on multiple PCs and a USB dongle is used to enable the package. Only the PC with the dongle fitted can run PillarPAD.
• PillarPAD is compatible with XP®, Vista® , Windows7®, Windows8® and Windows10®.

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The PillarGEN Nitrogen generation system has been specifically designed to meet the Nitrogen supply requirements of the current range of Pillarhouse selective soldering systems.
The latest Nitrogen generation design technology combines compact size with ultra-quiet operation.

The PillarGEN-30 is specifically designed to integrate with the Pillarhouse Pilot bench top soldering system.

The PillarGEN-40 and -80 systems offer a fully integrated communication protocol to allow the monitoring and displaying of the unit’s status on the selective soldering machine. These values include oxygen concentration, flow rates and pressure – incoming air/outgoing Nitrogen.

PillerGen 30 P/N 62206
PillerGen 40 P/N 62205

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With its patented easy bleed and cleaning feature it is ideal for automation use. The head comes complete with a hand control unit which allows the operator to fully program the spray head.

The spray function and length of spray duration are both fully programmable at intervals in milliseconds. The controller can be triggered by 24V or RS232 interface.

The PillarDOT system can also be supplied as part of an X,Y axis unit with conveyor transfer.

Wide ranging use applications include solar cell, medical and electronic applications.

Optional Extras:

• Flux Bottle and Low Pressure Regulator Assembly Panel. (Required if Customer Does not have their own flux containment/supply system)
• Standard Additional Flux Head
• Additional Titanium Flux Head
• Single 100 Non-Titanium micron Drop-Jet Flux Head
• Single 150 Non-Titanium micron Drop-Jet Flux Head
• Flux Head Titanium Top 100 micron
• Flux Head Titanium Top 150 micron
• Flux Head Titanium Top 200 micron (standard size)
• Drop Jet Maintenance Kit

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Incorporating high speed PCB transfer, the Orissa Fusion platform offers the ultimate in flexibility, coupled with reduced line length at a lower cost compared to current market offerings.
The standard four station cell can be configured to handle PCB’s up to 381mm x 460mm – fluxer, preheat, solder, solder. For high speed applications this same unit can be configured as fluxer/preheat and up to three solder modules with as many as five heater options.

An optional PCB transfer station and return conveyor enables product to be manually unloaded adjacent to the conveyor load station – this configuration reduces PCB handling capability to 381mm x 250mm.

Each solder cell can be configured with any of the currently available Pillarhouse solder technologies: custom-dip, multi-dip, Jet-Wave and single point AP down to the patented 1.5mm micro nozzle.

Easy, rapid non-contact solder pot changeover is facilitated via the optional heated pot exchange trolley.

Standard Features

• In-line motor driven width adjust through feed conveyor
• Conveyor side clamping
• DC servo drives with encoders on X, Y & Z axis
• Integral PC and machine mounted TFT monitor
• Inerted Nitrogen system
• Automatic fiducial correction system
• Motorised wire feed auto solder top-up & solder level detect
• Drop-Jet fluxer
• Solder wave height measurement and correction system
• Process viewing camera
• Multiple level password protection
• Solder bath coding – identifies correct bath for program
• Thermal nozzle calibration system using integrated setting camera (requires manual correction)
• Six AP solder nozzle tips
• Internal fume extraction
• Colour programming camera
• PillarCOMM Windows® based ‘Point & Click’ interface
• PillarPAD offline programming system
• Lead-free compatible
• Day-to-day service kit

Monitoring Options

• Flux presence sensor – thermistor style
• Flux spray, flow and spray & flow
• Pump rpm
• O2 ppm
• Nitrogen flow

System Options

• Ultrasonic fluxing
• Dual Drop-Jet / ultrasonic fluxing
• Top-side instant IR preheat
• Bottom-side IR preheat
• Closed loop pyrometer temperature control
• Large solder bath for dedicated single dip applications
• Laser PCB warp correction
• 5mm micro nozzle
• Solder reel identification
• Larger PCB handling size
• Nitrogen generator

P/N 62210

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Designed to meet the needs of the small batch manufacturer who requires high levels of production flexibility. The Jade Prodex offers the ability to regularly change solder alloys without incurring expensive down time, whilst the solder bath cools down and heats up during a regular manual changeover process.

The Prodex is an offline system, incorporating a quick load twin PCB universally adjustable rotary table transport system to allow simultaneous load / unload during product processing.

In its basic format, the Prodex is configured with a single solder bath. In its Duplex guise, the machine can be configured with twin adjacent solder baths on independent Z axis drives. This achieves increased production flexibility by permitting use of two different nozzle tip sizes which can be allocated as process requirements dictate within any particular area on a PCB.

All Prodex configurations can be offered with optional automatic heated solder bath change stations. Using this system the non-operational solder bath and pump system can be stationed at one of the two optional heated park positions located at either side of the main machine. This heated station, maintains the correct solder temperature within the bath that is idle so that when changeover occurs, the replacement bath can resume immediate production. A single automatic solder bath change station is identified as a PLUS configuration, whilst twin stations (located at both sides of the machine) are identified as PLUS PLUS configurations. On this basis Duplex machines with the PLUS PLUS identity will operate with 4 individual solder bath and pump systems.

The Prodex series is controlled by a PC, through PillarCOMM, a Windows® based ‘Point & Click’ interface with a PCB image display.

Additionally our optional PillarPAD offline programming package allows the operator to produce programs independently from the machine using Gerber data.

Standard Features

• DC servo drives
• Rotary indexing table with twin adjustable positions
• Integral PC and machine mounted TFT monitor
• Inerted Nitrogen system
• Auto motorised wire solder feed & level detect
• Solder bath coding – identifies correct bath for program
• Drop-Jet fluxer
• Manual fiducial correction system
• Solder wave height measurement and correction
• Process viewing camera(s)
• Multilevel password protection
• Light stack
• Six AP style solder nozzle tips
• Internal fume extraction
• Colour programming camera
• PillarPAD offline programming system
• Universally adjustable tooling carrier
• Thermal nozzle calibration system using integrated setting camera – requires manual correction
• PillarCOMM Windows® based ‘Point & Click’ interface
• Lead-free compatible
• Day-to-day service kit

Monitoring Options

• Flux presence sensor – thermistor style
• Flux spray, flow and spray & flow
• Pump rpm
• O2 ppm
• Nitrogen flow

System Options

• Side mounted auto bath changeover – PLUS configuration
• Top-side instant IR preheat
• Bottom-side slide in / out instant IR preheat
• Closed loop pyrometer temperature control
• Bottom-side hot Nitrogen selective preheat
• Automatic fiducial correction
• Ultrasonic fluxing
• Dual Drop-Jet / ultrasonic fluxing
• Laser PCB warp correction
• Twin solder bath capability on independent Z axis
• Micro nozzle assembly
• Large solder bath for dedicated single dip applications
• Solder bath removal trolley
• Solder reel identification
• Larger PCB handling size
• Nitrogen generator

P/N 62215

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Designed to meet the needs of the small batch manufacturer who requires high levels of production flexibility. The Jade PRO offers the ability to regularly change solder alloys without incurring expensive down time, whilst the solder bath cools down and heats up during a regular manual changeover process.

The Jade PRO is a hand load system, incorporating a universally adjustable tooling carrier capable of accommodating PCBs or pallets up to 457x508mm.
In its basic format, the Jade PRO is configured with a single solder bath. In the Jade PRO Duplex guise, the machine can be configured with twin adjacent solder baths on independent Z axis drives. This achieves increased production flexibility by permitting use of two different nozzle tip sizes which can be allocated as process requirements dictate within any particular area on a PCB.

All of the above Jade PRO configurations can be offered with optional automatic heated solder bath change stations. Using this system the non-operational solder bath and pump system is stationed at one of two heated park positions located at either side of the main machine.

This heated station maintains the correct solder temperature within the bath that is idle, so that when changeover occurs, the replacement bath can resume immediate production. A single automatic solder bath change station is identified as a PLUS configuration, whilst twin stations (located at both sides of the machine) are identified as PLUS PLUS configurations.
On this basis Duplex machines with the PLUS PLUS identity will operate with 4 individual solder bath and pump systems.

The Jade PRO series is controlled by a PC, through PillarCOMM, a Windows® based ‘Point & Click’ interface with a PCB image display.

Additionally our PillarPAD offline programming package allows the operator to produce programs independently from the machine using Gerber data.

Standard Features

• DC servo drives
• Integral PC and machine mounted TFT monitor
• Inerted Nitrogen system
• Auto motorised wire solder feed & level detect
• Solder bath coding – identifies correct bath for program
• Drop-Jet fluxer
• Manual fiducial correction system
• Solder wave height measurement and correction
• Process viewing camera(s)
• Multilevel password protection
• Light stack
• Six AP style solder nozzle tips
• Internal fume extraction
• Colour programming camera
• PillarPAD offline programming system
• Universally adjustable tooling carrier
• Thermal nozzle calibration system using integrated setting camera – requires manual correction
• PillarCOMM Windows® based ‘Point & Click’ interface
• Lead-free compatible
• Day-to-day service kit

Monitoring Options

• Flux presence sensor – thermistor style
• Flux spray, flow and spray & flow
• Pump rpm
• O2 ppm
• Nitrogen flow

System Options

• Side mounted auto bath changeover – PLUS configuration
• Top-side instant IR preheat
• Bottom-side slide in / out instant IR preheat
• Closed loop pyrometer temperature control
• Bottom side hot Nitrogen selective preheat
• Automatic fiducial correction
• Ultrasonic fluxing
• Dual Drop-Jet / ultrasonic fluxing
• Laser PCB warp correction
• Twin solder bath capability on independent Z axis
• Micro nozzle assembly
• Large solder bath for dedicated single dip applications
• Solder bath removal trolley
• Solder reel identification
• Larger PCB handling size

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With all the proven features of the Jade Mk II, the Jade Mk IV sets even higher standards of performance.

Designed to meet the needs of the small/medium batch manufacturer who requires high levels of production flexibility, the Jade MK IV entry-level system offers uncompromised selective soldering quality at a very low cost.

The Jade MK IV is a hand load system, incorporating a universally adjustable tooling carrier capable of accommodating PCB’s or pallets up to 508x610mm (20×24″).

Our patented Drop-Jet design fluxer offers quick and effective flushing of the pressurised flux chamber. This helps to keep maintenance levels to a minimum whilst enabling use of higher solid content fluxes as well as water-soluble fluxes.

As with all Pillarhouse systems, the soldering process is enhanced by a hot Nitrogen curtain which provides an inert atmosphere. This method of soldering also assists in the prevention of oxidisation and provides a local preheat to the joint, thus reducing thermal shock to localised components.

The Jade MK IV is controlled by a PC, through Enhanced PillarCOMM, a Windows® based ‘Point & Click’ interface with PCB image display.
Additionally, our PillarPAD offline package allows the operator to produce programs independently from the machine using Gerber data.

Standard Features:

• 508x610mm board size
• Integral PC and machine mounted TFT monitor
• Inerted Nitrogen system
• Motorised auto-solder top-up (wire feed) & solder level detect
• Drop-Jet fluxer
• Set of AP style solder nozzle tips
• Internal fume extraction
• Colour programming camera
• Solder wave height measurement and correction
• Universally adjustable tooling carrier
• Thermal nozzle calibration system using integrated setting camera (requires manual correction)
• Enhanced PillarCOMM Windows® based ‘Point & Click’ interface
• Multiple level password protection
• Automatic fiducial correction
• Auto-nozzle conditioning system
• New Solder bath and pump design
• Lead-free compatible
• Day-to-day service kit
• Items in bold are new features, when compared to Jade Mk II.

Monitoring Options

• Flux presence sensor – thermistor style
• Flux spray, flow and spray & flow
• Pump rpm
• O2 ppm
• Nitrogen flow

System Options

• Top side instant IR preheat
• Bottom side instant IR preheat
• Closed loop temperature control – via pyrometer or thermocouple
• Ultrasonic fluxing
• Dual Drop-Jet / ultrasonic fluxing
• Laser PCB warp correction
• Micro nozzle assembly
• Solder reel identification
• Rapid change solder bath and pump system capabilit
• Solder bath coding – identifies correct bath for program
• Nitrogen generator
• Items in bold are new features, when compared to Jade Mk II.

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Designed to meet the needs of the small/medium batch manufacturer who requires high levels of production flexibility, the Jade MKll entry-level system offers uncompromised selective soldering quality at a very low cost.

The Jade MKII is a hand load system, incorporating a universally adjustable tooling carrier capable of accommodating PCB’s or pallets up to 457 x 508mm.

Our patented Drop-Jet design fluxer offers quick and effective flushing of the pressurized flux chamber. This helps to keep maintenance levels to a minimum whilst enabling use of higher solid content fluxes as well as water-soluble fluxes.

As with all Pillarhouse systems, the soldering process is enhanced by a hot Nitrogen curtain which provides an inert atmosphere. This method of soldering also assists in the prevention of oxidization and provides a local preheat to the joint, thus reducing thermal shock to localized components.

The Jade MKII is controlled by a PC, through PillarCOMM, a Windows® based ‘Point & Click’ interface with PCB image display.

Standard Features

• Integral PC and machine mounted TFT monitor
• Inerted Nitrogen system
• Auto solder top-up (wire feed) & solder level detect
• Drop-Jet fluxer
• Set of AP style solder nozzle tips
• Internal fume extraction
• Colour programming camera
• Solder wave height measurement and correction
• Universally adjustable tooling carrier
• Thermal nozzle calibration system using integrated setting camera (requires manual correction)
• PillarCOMM Windows® based ‘Point & Click’ interface
• Multiple level password protection
• Manual fiducial correction
• Lead-free compatible
• Day-to-day service kit

Monitoring Options

• Flux presence sensor – thermistor style
• Flux spray, flow and spray & flow
• Pump rpm
• O2 ppm
• Nitrogen flow

System Options

• Top-side instant IR preheat
• Closed loop temperature control – via pyrometer or thermocouple
• Bottom-side IR ring heater
• Bottom-side hot Nitrogen selective preheat
• Automatic fiducial correction
• Ultrasonic fluxing
• Dual Drop-Jet / ultrasonic fluxing
• Laser PCB warp correction
• Micro nozzle assembly
• Solder reel identification
• Rapid change solder bath and pump system capability – does not include solder bath and pump
• Solder bath coding – identifies correct bath for program – only suitable for use with rapid change solder bath and pump system
• Encoders on X, Y and Z axis
• Larger PCB handling size
• Nitrogen generator

P/N 62212

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The Jade-Handex is equipped with a revolutionary twin PCB rotary table transport system to allow simultaneous load / unload during product processing.

Our new generation patented drop-jet design fluxer offers quick and effective flushing of the pressurised flux chamber. This helps to keep maintenance levels to a minimum whilst enabling use of higher solids content fluxes as well as water soluble fluxes.

As part of the entry level philosophy for this system, a newly designed low maintenance solder bath and pump mechanism has been developed which moves in three axes of movement whilst not limiting access to the PCB. Solder is applied using proven technology through our AP-1 nozzle design or custom specialised nozzles, incorporating patented spiral solder return to bath technology offering reduced solder balling potential.

As with more sophisticated Pillarhouse systems, the soldering process is enhanced by an inerted hot Nitrogen curtain which provides an inert atmosphere for the soldering process and also assists in the prevention of oxidation. This process provides a local pre-heat to the joint thus reducing thermal shock to localised components.

The Jade-Handex is controlled by a PC, through PillarCOMM, a Windows^® based “Point & Click” interface with PCB image display, as illustrated below. Additionally, our PillarPAD offline package allows the operator to produce programs independently from the machine using Gerber data.

Standard Features

• Integral PC and machine mounted TFT monitor
• Auto solder top up & level detect
• Inerted Nitrogen system
• Drop-jet fluxer
• Set of AP-1 solder nozzle tips
• Internal fume extraction
• Colour programming camera
• Rotary indexing table with twin work holding positions
• PillarCOMM windows software
• Manual fiducial correction system
• Multiple level password protection
• PillarPAD offline programming system
• Flux level sensor
• Process viewing camera with record feature
• Solder wave height measurement and correction system
• Lead free capability
• Day-to-day service kit

Monitoring Options

• Flux presence sensor – thermistor style
• Flux spray monitoring
• Flux flow monitoring
• Flux spray & flow monitoring
• O₂ppm monitoring
• Pump rpm monitoring
• Nitrogen flow monitoring

System Options

• Ultrasonic fluxing
• Dual drop-jet / ultrasonic fluxing
• Top side instant I.R. pre-heat
• Bottom side slide in / slide out I.R. pre-heat
• Pyrometer closed loop temperature control
• Automatic fiducial correction system
• Laser board warpage control
• Solder reel identification
• Solder bath coding (identifies correct bath for program)
• Encoders on X, Y and Z axis
• Nitrogen generator

P/N 62214

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