יכולות חדשות בדגם  SLX

• אין צורך בזמן עבור הגדרות משתמש לאיסוף הנתונים – מספר זיכרונות רב לאחסון פרופילים.
• תחום מדידה ודיוק +/- 0.5°C – -200 to 1372 °C
• הורדת נתונים בחיבור USB מהירה במיוחד
• אופציה לחיבור אלחוטי בתדר תקשורת + 2.4Ghz
• תהליך אוטומטי לבדיקה והצגת נתוני הטרמוקפלים
• סוללה בעלת עמידות לטמפרטורה גבוהה ברת החלפה על ידי המשתמש.

ב ASI מומחים בתחום אשר ישמחו לתת מענה לכל שאלה, צרו קשר.

The post פרופיילר SOLDERSTAR SLX appeared first on ASI Technologies.

The WaveShuttle Multi-Wave Selective gives precise measurement and control for Multi-Wave Selective soldering machines.

Multi-Wave Selective Soldering machines offer electronic manufacturers the fast throughput while maintaining the benefits of only introducing the solder wave to the areas where through hole components need to be soldered. The throughput increase does however results in a reduction in flexibility, with dedicated nozzle designs needed matching the assemblies being soldered in production. Different nozzle shapes and sizes employed in the production soldering tooling exhibit different dynamics when the PCB is presented to the solder. The perfect process would result in contact between PCB and solder occurring both simultaneous and for the same contacts time, until now it was not possible to measure these crucial parameters.

The SolderStar Multi-Wave PRO allows Production Engineers to better understand the contact dynamics of this soldering process. A compact and flexible instrument has been designed to allow dedicated test fixtures to be produced quickly and cost effectively for multi-wave soldering machines, measurement sensors are fitted to customer specific locations which correspond to the soldering areas within the multi-wave solder pot tooling, this technique provides contact time and difference data to quickly allow engineers to identify any problem areas within the tool design. Any differences in nozzle to PCB contact can be easily measured providing a powerful platform for process capability analysis, improvement and on-going testing.

Date Capture and Analysis

Captured data is download via USB or Wireless interface for analysis on the engineers computer. All parameters can be quickly analysed and using the unique Solderstar Process Checker functions allow good/bad limits to be defined to allow periodic process verification to be performed without the need for specialist knowledge.

The WaveShuttle Multi-Wave Pro is supplied with Wave Central PC Software, a dedicated package for the analysis of all key wave soldering and selective parameters.  Based on Solder Star’s interface and navigation system it allows users of other SolderStar products to perform detailed wave solder analysis with minimal training.

The post Solderstar | Multi Wave/Dip Solder Instruments appeared first on ASI Technologies.

Nozzle strikes on clinched components or the PCB due to PCB warp or general tolerances can result in the positioning mechanism of the machine becoming mis-aligned. X and Y positioning mechanism and speed are verified by sweeping the selective soldering nozzles between pre-defined datum’s. An array of stepped contact sensors are employed to allow nozzle wave height measurements to be made and periodically verified.

Flux Sensing

When crystallisation occurs in the selective fluxer nozzle mis-fluxing of components can occur causing problems with poor wetting or leaving un-activated flux on area of the assembly. To combat this problem SolderStar has developed flux measurement sensors which can be optionally installed to the measurement fixture, this allows for flux presence and position to be obtained as part of the daily tests.

Date Capture and Analysis

Captured data is download via USB or Wireless interface for analysis on the engineers computer. All parameters can be quickly analysed and using the unique Solderstar Process Checker functions allow good/bad limits to be defined to allow periodic process verification to be performed without the need for specialist knowledge.

The WaveShuttle Pro is supplied with Wave Central PC Software, a dedicated package for the analysis of all key wave soldering parameters.  Based on Solder Star’s interface and navigation system it allows users of other SolderStar products to perform detailed wave solder analysis with minimal training.

The post Solderstar | Mini-Wave Selective Analyzer appeared first on ASI Technologies.

This unique fixture incorporates two measurement systems to give the most comprehensive and repeatable measurement results of any analyser on the market today. Measurement of wave contact time, wave height, wave parallelism and temperature profile are all required to correctly setup the wave solder machine correctly, these measurements can now be captured in one single pass using this innovative and convenient device

The WaveShuttle Pro is designed for the rigours of daily production testing, manufactured from 10mm anti-static composite and fitted with durable titanium side rails. This intelligent measurement fixture incorporates titanium contact sensors on the underside that capture wave parameters data as it moves through the solder wave, including a true measurement of wave height. Additionally the system measures preheat profiles and solder pot temperatures.

Graphical Analysis of Chip/Main Wave Shape & Contact

Date Capture and Analysis

All key process parameters are captured with single run through the machine, data is then download via USB or Wireless interface for analysis on the engineers computer. All parameters can be quickly analysed and using the unique Solderstar Process Checker functions allow good/bad limits to be defined to allow periodic process verification to be performed without the need for specialist knowledge.

Instant Good/Bad Indication

The WaveShuttle Pro is supplied with Wave Central PC Software, a dedicated package for the analysis of all key wave soldering parameters.  Based on SolderStar’s interface and navigation system it allows users of other SolderStar products to perform detailed wave solder analysis with minimal training

The post Solderstar | Wave Solder Machine Analyser appeared first on ASI Technologies.

Vapour phase soldering is not a new process, and with advanced machines available it is common place where throughput is not the main concern. Like all production processes, without proper control, problems will occur such as tombstoning or component positioning problems due to overly aggressive vacuum settings. The Solderstar system is specifically developed to pass through the VP process with the electronic assembly to allow the engineer to measure and understand this process fully.

The Solderstar VP systems uses a specially developed two-piece protective shield, fully machined from aluminium this enclosure is both ‘O’ ring sealed and Teflon coated to maximise the protection of the measuring instrument while passing through this harsh environment process.

Low Impact Design

This  aluminium design provides an extremely low mass solution, minimising any possible impact on the process temperatures.  Once retrieved from the process, the hot shield can be opened and the instrument removed minimising the potential for instrument damage and reducing overall cool down cycle. Data captured can then be downloaded to a PC for analysis by the engineer.

An innovative 2.4Ghz telemetry link is optionally available for this system, a ‘self healing’ mesh network technology has been employed which allows data to be fed live from within the process chamber, even within the vacuum stage allowing for precision monitoring and setup of actual product temperatures.

The post Solderstar | Vapour Phase Thermal Profiler appeared first on ASI Technologies.

The SolderStar PRO reflow systems include our latest evolution of ultra-compact datalogger featuring the unique SolderStar ‘SmartLink’ connector system.  The datalogger unit is docked into a protective heat shield and thermocouple adapter combination to provide the number of measurement channels required for the product profiling applications. Future upgrading or servicing is a simple and cost effective procedure, with only the Thermocouple Adapter needing to be changed to allow 6,9,12 or 16 Type-K measurement versions.

The‘SmartLink’ concept results in a smaller profiling instrument footprint, allowing the systems to easily pass though ovens with low tunnel heights or when narrow electronic assemblies are being produced. Additionally it provides a quick connection to a range of accessories for capture of profile and SPC information from reflow, wave/selective and vapour phase soldering processes.

Profile optimisation

For profile optimisation, the AutoSeeker Profile Optimiser can be added to the systems to provide rapid profile setup. Once a profile has been captured from the process, the AUTOSeeker will search through millions of combinations of oven set points, to provide suggested settings for both temperature and speed.

The systems can optionally provide live profiling data direct to the engineer computer via our class leading 2.4 GHz wireless telemetry system, the bespoke system used in SolderStar products provide a full two way link, resulting in no data loss during the streaming of live data.

These profiling systems provide the engineer with all the necessary software tools for rapid profile setup and analysis, along with data management, profile simulations and integrated SPC charting tools.

The post Solderstar | Thermal Profilers appeared first on ASI Technologies.

With increasing electronic assembly complexity and values, combined with the need for long term reliability or safety critical products, the need for continuous monitoring of productions processes has become common place.

• Automates recording of the profiling process
• Provides 100% product traceability for every electronic assembly produced
• SMEMA Integration
• Email alerts
• Automatic changeover detection via barcode interfaces

The SolderStar APS provides full time process monitoring of the reflow soldering process, the system is capable of recording process conditions and the temperature profile for every electronic assembly that passes through the assembly line.

Ultra-thin temperature probes are permanently mounted along the length of each oven conveyor allowing measurement of variation within product level temperature.  This newly developed probe allows for a smaller physical size which offers two significant advantages, fast response to changing oven loading and the reduction of shadowing problems associated with components mounted close to the conveyor rails.

Product speed and position are monitored by way of dedicated speed monitoring instrumentation, combined with optical sensors and a new software algorithm, resulting in a 'True Profile' for every board processed.  PC software automatically calculates all important process parameters and checks for values outside defined limits for the process.

On exit of the PCB assembly from the oven all process conditions and calculated profiles are stored along with a unique ID in a database for complete product traceability.  Should the measured parameters drift outside process limits the system immediately stops further entry of assemblies into the machine via a standard SMEMA interface and alerts line staff that remedial action is required.

Traceability, barcoding and SMEMA integration

Where barcoding is available the APS has the ability to automatically detect product changeover on the production line, allowing for automation of batch/product changeover.  APS can also integrate with the oven controller to request recipe changes automatically.

Additionally, the APS has SMEMA functionality which allows the APS to control the flow of product into the reflow oven, these two features make a very powerful system.

The post Solderstar | Automatic Profiling Systems appeared first on ASI Technologies.

The SolderStar DeltaProbe is periodically passed through the reflow process to allow rapid verification of oven conditions against a stored baseline profile.  Process change, due to variations in convection levels, conveyor speed or zone set-points, are instantly and accurately detected and the operator is notified visually through the PC analysis software.  Integrated SPC tools allow the operator to produce process control charts for ongoing process control measurement, evaluation and corrective action.

The DeltaProbe solution removes the need to use fragile test boards for periodic profiling required for ongoing control of the reflow process.  Although profile setup requires a temperature profile to be captured from a real test PCB, ongoing periodic process monitoring can be achieved by measuring the difference from an established process baseline.  The DeltaProbe device is passed periodically through the process to provide oven verification and ease SPC data capture.

With matched sensors and no test card or long trailing wires, the DeltaProbe streamlines the procedure of daily testing of the reflow process and generates highly repeatable oven measurements. It incorporates an adjustable carrier frame which can be set to the production conveyor width and can be used without any disruption to production flow.

A 'gold standard’ for each process is established in 3 easy steps:

1. Optimum oven settings are first established by product profile capture and simulation
2. The DeltaProbe is passed through the reflow oven to capture a 'golden process profile'
3. Tolerance limits are set around temperature traces and process parameters

Process change, due to variations in convection levels, conveyor speed or zone set-points, are instantly and accurately detected and the operator is notified visually. Integrated SPC tools allow the operator to produce process control charts for ongoing process control measurement, evaluation and corrective action.

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