The SolderStar PRO reflow systems include our latest evolution of ultra-compact datalogger featuring the unique SolderStar ‘SmartLink’ connector system.  The datalogger unit is docked into a protective heat shield and thermocouple adapter combination to provide the number of measurement channels required for the product profiling applications. Future upgrading or servicing is a simple and cost effective procedure, with only the Thermocouple Adapter needing to be changed to allow 6,9,12 or 16 Type-K measurement versions.

The‘SmartLink’ concept results in a smaller profiling instrument footprint, allowing the systems to easily pass though ovens with low tunnel heights or when narrow electronic assemblies are being produced. Additionally it provides a quick connection to a range of accessories for capture of profile and SPC information from reflow, wave/selective and vapour phase soldering processes.

Profile optimisation

For profile optimisation, the AutoSeeker Profile Optimiser can be added to the systems to provide rapid profile setup. Once a profile has been captured from the process, the AUTOSeeker will search through millions of combinations of oven set points, to provide suggested settings for both temperature and speed.

The systems can optionally provide live profiling data direct to the engineer computer via our class leading 2.4 GHz wireless telemetry system, the bespoke system used in SolderStar products provide a full two way link, resulting in no data loss during the streaming of live data.

These profiling systems provide the engineer with all the necessary software tools for rapid profile setup and analysis, along with data management, profile simulations and integrated SPC charting tools.

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With increasing electronic assembly complexity and values, combined with the need for long term reliability or safety critical products, the need for continuous monitoring of productions processes has become common place.

• Automates recording of the profiling process
• Provides 100% product traceability for every electronic assembly produced
• SMEMA Integration
• Email alerts
• Automatic changeover detection via barcode interfaces

The SolderStar APS provides full time process monitoring of the reflow soldering process, the system is capable of recording process conditions and the temperature profile for every electronic assembly that passes through the assembly line.

Ultra-thin temperature probes are permanently mounted along the length of each oven conveyor allowing measurement of variation within product level temperature.  This newly developed probe allows for a smaller physical size which offers two significant advantages, fast response to changing oven loading and the reduction of shadowing problems associated with components mounted close to the conveyor rails.

Product speed and position are monitored by way of dedicated speed monitoring instrumentation, combined with optical sensors and a new software algorithm, resulting in a 'True Profile' for every board processed.  PC software automatically calculates all important process parameters and checks for values outside defined limits for the process.

On exit of the PCB assembly from the oven all process conditions and calculated profiles are stored along with a unique ID in a database for complete product traceability.  Should the measured parameters drift outside process limits the system immediately stops further entry of assemblies into the machine via a standard SMEMA interface and alerts line staff that remedial action is required.

Traceability, barcoding and SMEMA integration

Where barcoding is available the APS has the ability to automatically detect product changeover on the production line, allowing for automation of batch/product changeover.  APS can also integrate with the oven controller to request recipe changes automatically.

Additionally, the APS has SMEMA functionality which allows the APS to control the flow of product into the reflow oven, these two features make a very powerful system.

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The SolderStar DeltaProbe is periodically passed through the reflow process to allow rapid verification of oven conditions against a stored baseline profile.  Process change, due to variations in convection levels, conveyor speed or zone set-points, are instantly and accurately detected and the operator is notified visually through the PC analysis software.  Integrated SPC tools allow the operator to produce process control charts for ongoing process control measurement, evaluation and corrective action.

The DeltaProbe solution removes the need to use fragile test boards for periodic profiling required for ongoing control of the reflow process.  Although profile setup requires a temperature profile to be captured from a real test PCB, ongoing periodic process monitoring can be achieved by measuring the difference from an established process baseline.  The DeltaProbe device is passed periodically through the process to provide oven verification and ease SPC data capture.

With matched sensors and no test card or long trailing wires, the DeltaProbe streamlines the procedure of daily testing of the reflow process and generates highly repeatable oven measurements. It incorporates an adjustable carrier frame which can be set to the production conveyor width and can be used without any disruption to production flow.

A 'gold standard’ for each process is established in 3 easy steps:

1. Optimum oven settings are first established by product profile capture and simulation
2. The DeltaProbe is passed through the reflow oven to capture a 'golden process profile'
3. Tolerance limits are set around temperature traces and process parameters

Process change, due to variations in convection levels, conveyor speed or zone set-points, are instantly and accurately detected and the operator is notified visually. Integrated SPC tools allow the operator to produce process control charts for ongoing process control measurement, evaluation and corrective action.

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