As the successor to VIGON® RC 101, VIGON® RC 303 delivers improved cleaning performance along with increased operator safety.

Advantages of VIGON® RC 303 compared to other cleaners:

• Improved cleaning performance
• Direct application to warm surfaces (40-50°C / 104-122°F) possible as a result of no flash point
• Decreased soaking time improves overall cleaning process and minimizes equipment downtime
• Excellent material compatibility with aluminum and epoxy surfaces
• Improved formulation with reduced VOC emissions
• Environmentally friendly
• Low odor

Advantages of cleaning with VIGON® RC 303 in wave solder systems:

• Reduced cleaning agent consumption compared to IPA
• Operator safety improved as a result of no flashpoint and lower VOC emissions

The post Zestron | Vigon RC 303 Water-based Cleaning Agent for Reflow Ovens and Wave Solder Systems appeared first on ASI Technologies.

ATRON® SP 200 is an aqueous-alkaline surfactant cleaner, specifically developed to remove baked-on fluxes from solder pallets and condensation traps. ATRON® SP 200 can be used for the removal of unsoldered solder pastes from SMT stencils. The cleaner can be used in air assisted, spray-in-air and ultrasonic cleaning equipment.

Advantages compared to other surfactant cleaners:

• Simple, easy-to-use handling
• 3 to 10 times longer bath life than traditional surfactant cleaners
• Reduced number of bath changes results in a lower volume of used cleaner that requires disposal, thereby reducing process costs
• Excellent compatibility with aluminum and epoxy surfaces
• Does not leave residues on cleaning equipment
• No build-up of organics in the rinsing section
• Suitable for cleaning conveyor fingers and the removal of extremely baked-on flux residues in solder ovens and similar applications
• Halogen free
• Low VOC product
• Clean Air Solvent certified product

The post Zestron | Atron SP 200 Aqueous-based Cleaning Medium for Baked-on Flux Removal appeared first on ASI Technologies.