Advantages compared to other surfactant cleaners:

• Due to its polar and nonpolar components, it is suitable for a wide range of applications
• Completely distillable and therefore suitable for one chamber vapor degreaser processes with vacuum distillation and vapor rinsing
• Halogen and surfactant-free
• Dries residue-free
• Ideal for use in water-free applications, especially when water rinsing is restricted
• Ideal for cleaning capillary spaces, such as underneath BGA’s and flipchips
• Applicable for stencil cleaning and underside wipe processes in SMT printers

The post Zestron | VD Solvent-based Cleaning Medium for Defluxing appeared first on ASI Technologies.

Advantages compared to other cleaners:

• Due to its neutral pH value, it demonstrates an unprecedented level of material compatibility with sensitive materials such as aluminum, brass, copper, plastics, labels and inks
• Performs well at low application concentrations in specific processes
• No need for waste water neutralization
• Halogen-free

The post Zestron | Vigon N600 Aqueous-based, pH neutral Defluxing Agent for Spray-in-air Cleaning Processes appeared first on ASI Technologies.

VIGON® A 250, based on the MPC® Technology (Micro Phase Cleaning), is an aqueous-based cleaning agent designed specifically for low and medium pressure spray-in-air processes with long exposure times. It is recommended for removing a wide range of flux residues from electronic assemblies. VIGON® A 250‘s mild formulation is particularly gentle on all solder joints and materials.

Advantages compared to other surfactant cleaners:

• Specifically developed for batch cleaning applications
• Ability to remove a wide range of flux residues
• Excellent material compatibility, even with long contact times
• High bath loading capacity ensures an extended bath life, low maintenance costs and reduced costs per cleaned part
• Surfactant-free formulation prevents the formation of white residues on cleaned parts as well as cleaning equipment and eliminates time consuming surfactant monitoring
• Mild formulation results in shiny solder joints and low ionic contamination values

The post Zestron | Vigon A 250 Aqueous-based Defluxing Agent for low and medium Pressure Cleaning Processes appeared first on ASI Technologies.

Advantages compared to other surfactant cleaners:

• Specifically developed for inline cleaning applications
• Ability to clean a wide range of flux residues
• Excellent cleaning results even in cleaning processes with short exposure time
• High bath loading capacity ensures an extended bath life, low maintenance costs and reduced costs per cleaned part
• Surfactant-free formulation eliminates the formation of white residues on cleaned parts as well as cleaning equipment and eliminates time-consuming surfactant monitoring
• Does not foam, even in high pressure applications
• Halogen free

The post Zestron | Vigon A 201 Aqueous-based Defluxing Agent for High Pressure Cleaning Processes appeared first on ASI Technologies.

Advantages compared to other surfactant cleaners:

• Clean Air Solvent certified product
• Specifically formulated for excellent compatibility with aluminum and epoxy surfaces
• VOC content of less than 25 g/l at its recommended concentration of 5%
• Halogen-free
• Low odor

The post Zestron | Atron AC300 Aqueous-based Cleaning Medium for Flux Removal appeared first on ASI Technologies.

Advantages compared to other surfactant cleaners:

• Due to its mild formulation and the low operating concentration, the cleaning agent demonstrates a superior level of material compatibility with sensitive metals such as aluminum, brass, nickel, etc.
• Excellent cleaning performance, at low concentrations and temperatures
• Allows for a quicker removal of a wide variety of the latest lead-free and eutectic flux residues
• Exceptionally longer bath life (3 to 10 times) than traditional surfactant-based cleaners
• Gentle formulation leaves solder joints and pads shiny and bright

The post Zestron | Atron AC207 Aqueous-based Cleaning Medium for Defluxing Applications in Spray-in-air Processes appeared first on ASI Technologies.

ATRON® AC 205 is a FAST® Technology based cleaning agent specifically designed to remove flux residues from electronic assemblies. The product was developed to improve the cleaning performance and bath life of traditional surfactant-based cleaners, thereby significantly reducing overall cleaning costs. ATRON® AC 205’s mild formulation is particularly gentle on all materials and solder joints. ATRON® AC 205 can be used as a drop-in replacement for high and medium pressure, inline and batch cleaning systems.

Advantages compared to other surfactant cleaners:

• Ethanolamine-free
• Enables fast removal of a wide variety of the latest lead-free and eutectic flux residues
• 3 to 10 times longer bath-life than traditional surfactant cleaners
• The non-foaming formula does not promote “white scaling”
• Gentle formulation leaves solder joints and pads shiny and bright
• Low odor

The post Zestron | Atron AC 205 Flux Residues Remover appeared first on ASI Technologies.

Advantages compared to other surfactant cleaners:

• High bath loading capability results in long bath life
• Does not require any specific explosion-proof environment
• Due to the surfactant-free formulation, it is easily rinsed
• Increases wire bonding/molding quality for power modules, leadframe-based discrete components and Power LEDs
• Ensures a void-free underfill and improves the image resolution by removing all tacky fluxes from Flip Chips/CMOS
• Has been EMPF Phase II tested and MIL approved
• Listed on the ESA ‘list of declared materials’

The post Zestron | FA+Solvent-based Medium for PCB Flux Removal appeared first on ASI Technologies.

Modern HFE co-solvent cleaning processes are available options if a short process, drying time and/or water-free cleaning is required.  This is often utilized in the military and aerospace industries. HFEs (hydrofluoroethers) were developed as a replacement for CFCs or similar solvents exhibiting the following properties: nonflammable, non-conductive, dries quickly and residue-free.

With a co-solvent, HFE is used in a cleaning bath with spray-under-immersion or ultrasonic agitation in order to dissolve persistent residues. The rinsing step takes place in a bath with HFE only and subsequently with steam rinsing. The substrates are then dried by intensive cooling. This process must be carried out in a cleaning machine with efficient cooling technology, preventing the evaporation of HFE.

The post Zestron | HFE Water-free Co-Solvent appeared first on ASI Technologies.

Specifications:

• Non-flammable
• Non-conductive
• Low toxicity
• Low Global Warming Potential (GWP)
• Zero ozone depletion potential
• Low surface tension penetrates tight spaces for improved cleaning

The post 3M™ | Novec™ 71IPA Light Cleaning and Degreasing appeared first on ASI Technologies.

נוזלים מהונדסים של 3M Novec מציעים יתרונות טכניים וכלכליים רבים ליצרני מכשירים רפואיים.

מתח פנים נמוך, צמיגות נמוכה וצפיפות נוזלים גבוהה הופכים את נוזלי הנובק לאידיאליים לשימוש בציוד קומפקטי להסרת שומני אדים ובתהליכי ניקוי אולטרא-סוני לניקוי והסרת חלקיקים ממגוון רחב של מצעים, מבלי להתפשר על דרישות הניקיון. נוזלי נובק חודרים בקלות לחללים צרים על חלקים מורכבים כמו שתלים אורטופדיים, ואז מתנקזים בקלות ומתאדים מבלי להשאיר סימני ייבוש.

כאשר משתמשים בנוזלים של נובק בציוד מתאים, זמני מחזור הניקוי כמו גם ייבוש, צריכת ממס ופליטות מופחתים משמעותית.

ניתן לייצר את הדגריזר גם במידות גדולות יותר.

The post 3M™ | Novec™ 73DE heavy-duty Vapor Degreaser appeared first on ASI Technologies.

Specifications

• Non-flammable
• Non-conductive
• Low toxicity
• Low Global Warming Potential (GWP)
• Zero ozone depletion potential
• Low surface tension penetrates tight spaces for improved cleaning
• Excellent for removal of ionic contamination

The post 3M™ | Novec™ 72DA Flux Removal and Vapor Degreasing appeared first on ASI Technologies.

Specifications

• Non-flammable
• Non-conductive
• Low toxicity
• Low Global Warming Potential (GWP)
• Zero ozone depletion potential
• Low surface tension penetrates tight spaces for improved cleaning
• Excellent for removal of ionic contamination

The post 3M™ | Novec™ 71DA Flux Removal and Vapor Degreasing appeared first on ASI Technologies.