ZESTRON® SW is a solvent-based cleaner with a high flash point, specifically designed for use in SMT printers without vacuum drying. With reproducible cleaning results and residue-free drying, the reliability of printing processes is greatly increased.

Advantages compared to other surfactant cleaners:

• Ideal for removing leaded and lead-free solder pastes from the stencil underside
• Dries fast and residue free
• Good delineation stability and reduced solder balling (see Technical Information 4)
• High flash point (67°C/153°F) for safe printer operation
• Halogen free

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VIGON® UC 160 based on MPC® Technology, is an aqueous-based cleaning agent designed to effectively remove solder paste residues from fine pitch stencil apertures in SMT printers. With low evaporative losses and effective wettability, product consumption is minimized and wipe cycles are reduced for optimal line operation.

Advantages compared to other cleaners:

• Ideal for cleaning leaded and lead free solder paste from fine pitch stencil apertures during stencil underside wipe applications
• Due to its water-based formulation, this cleaning agent evaporates significantly more slowly than IPA, limiting evaporative losses
• No flash point and evaporates residue free
• Aqueous-based, surfactant-free cleaner with excellent material compatibility on all wetted parts (stencils & printers)
• No scaling or residue build up
• Halogen free
• Low odor

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VIGON® SC 210, based on the MPC® Technology, is an aqueous-based cleaning agent specifically developed to clean SMT stencils. The cleaning agent reliably removes solder pastes and SMT adhesives in a single process and provides excellent cleaning results, even at low temperatures. VIGON® SC 210 is designed to be used in spray-in-air and ultrasonic cleaning systems.

Advantages compared to other surfactant cleaners:

• Consistently good cleaning results at temperatures between 18-40°C/64-104°F
• High bath loading capability providing extended bath life and reduced cleaning agent costs
• Aqueous-based, surfactant-free cleaner; leaves no residues on substrates or inside the equipment
• Excellent material compatibility
• No flash point and thus, can be used without explosion-proof protection
• Non-foaming when used in spray-in-air and ultrasonic systems
• Halogen free
• Low odor

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VIGON® SC 202, based on MPC® Technology (Micro Phase Cleaning), is an aqueous-based cleaning agent designed for the reliable removal of solder pastes and SMT adhesives from stencils. The product has also been developed to clean double-sided misprints, with one side already soldered. The cleaning agent is recommended to be used in spray-in-air and ultrasonic cleaning systems.

Advantages compared to other surfactant cleaners:

• Specifically developed for the removal of fluxes from doublesided misprinted boards with one side soldered
• Easily filtered and therefore provides an extended bath life and reduces cleaning agent costs
• Surfactant-free and can be easily rinsed residue-free
• No flash point and can be used in equipment without explosion proof protection
• The cleaner is applicable in spray-in-air systems and ultrasonic dip tanks
• No foaming when used in spray-in-air systems
• Halogen free
• Low odor

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VIGON® SC 200, based on the MPC® Technology (Micro Phase Cleaning), is a aqueous-based cleaning agent designed to clean SMT stencils at room temperature. The cleaning agent reliably removes solder pastes and SMT adhesives in one single process and can also be used for stencil underside wipe processes in printers. It is designed for use in spray-in-air and ultrasonic cleaning systems and is also recommended for the cleaning of misprinted solder paste. Depending on the type of flux, VIGON® SC 200 can also be suggested for both double-sided and single-side soldered circuit boards.

Advantages compared to other surfactant cleaners:

• Consistently good cleaning results at temperatures between 18-40°C / 64-104°F
• High bath loading capability providing extended bath life and reduced cleaning agent costs
• Aqueous-based, surfactant-free cleaner; leaves no residues on substrates or inside the equipment
• Excellent material compatibility
• No flash point and thus, can be used without explosion-proof protection
• Non foaming when used in spray in air and ultrasonic systems
• Halogen free
• Low odor

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