ציוד להלחמה | SMT דבק לרכיבים משטחיים - ASI Technologies

AIM | Surface Mount Epoxy 4044

kramer.niels — Sat, 05 Jan 2019 10:25:02 +0000

Epoxy 4044 is a single component, epoxy adhesive used for bonding SMT components to a PWB for double sided reflow or wave solder assembly. Epoxy 4044 has a formulated tolerance to shear-thinning, a dot formation suitable for automated dispense equipment or positive displacement pump systems, and quick cure properties when exposed to heat. Viscosity and surface tension of Epoxy 4044 are adequate for use with high speed placement equipment.

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AIM | Underfill FF35 One Component Epoxy Resin

zivit.drori — Wed, 30 May 2018 14:40:00 +0000

Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underfill FF35 offers superior reliability through high Tg, low CTE, good fill, no voiding, compatibility with no-clean flux residues and excellent adhesion. Faster throughput and higher yields are achieved through excellent capillary action, faster flow characteristics and rapid cure speeds. Underfill FF35 may be reworked at 120°C (250°F). The viscosity of Underfill FF35 remains stable throughout its shelf life. This product is suitable for bare chip protection in a broad variety of small die applications.

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AIM | One Step Underfill 688 One Component Epoxy Resin

zivit.drori — Wed, 30 May 2018 14:34:27 +0000

One-Step Underfill 688 is a low surface tension, one component epoxy resin designed as a one-step no-flow underfill for flip chip, CSP, BGA and micro-BGA assemblies. One-Step Underfill 688 improves product reliability through high Tg, low CTE, and good fill with no voiding. Even though One-Step Underfill 688 does not require flux, it is compatible with no-clean flux residues and provides excellent adhesion. One-Step Underfill 688 can be dispensed directly following solder paste printing, after which components are placed and the entire assembly is reflowed and cured simultaneously in a standard lead-free reflow process. This eliminates the need for a second assembly process and separate cure cycle. The result of this is faster throughput and higher yields that are achieved in one step through excellent capillary action, fast reflow characteristics, and rapid cure speeds. One-Step Underfill 688 may be reworked at 120° C and the viscosity of the product remains stable through out its shelf life. This product wets solder to OSP, ENIG, immersion silver, and immersion tin board surfaces.

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