The CondensoX series is based on a well-conceived design, in particular with regard to the hermetically sealed process chamber. Without moving the PCB during the process, the CondensoXP combines vacuum profiling and temperature profiling into a single system. Since the PCBs are not moved during the process, any shifting of the components is virtually ruled out. This, as well as outstanding temperature profiling, reduces failure rates and improves total cost of ownership.

In the case of the CondensoXP variant, the loading axis is laid out such that it’s suitable for hook up to an automated loading unit. The CondensoXP HS is equipped with a second loading axis for increased throughput. The process chamber can thus be reloaded while the workpiece carrier is being cooled down at the same time. This system is perfect for use in high-speed production lines.

Features

• Ideal for processing high-mass PCBs
• Smallest possible ΔT
• Extremely effective and homogenous heat transfer over the entire PCB
• Maximum soldering temperature limited by the medium’s boiling point
• A patented injection process assures reproducible soldering results and permits ideal profiling
• Void-free soldering thanks to vacuum option for best possible results
• Gradient control
• No time lost with profiling
• Outstanding retraceability of all processes with wireless profiling system (WPS)

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The CondensoX series is based on a well-conceived design, in particular with regard to the hermetically sealed process chamber. Without moving the PCB during the process, the CondensoXM combines vacuum profiling and temperature profiling into a single system. Since the PCBs are not moved during the process, any shifting of the components is virtually ruled out. This, as well as outstanding temperature profiling, reduces failure rates and improves total cost of ownership.The CondensoXM is equipped with an extended conveyor axis, and can thus be flexibly integrated into the existing workflow.

Features

• Ideal for processing high-mass PCBs
• Smallest possible Δ T
• Extremely effective and homogenous heat transfer over the entire PCB
• Maximum soldering temperature limited by the medium’s boiling point
• A patented injection process assures reproducible soldering results and permits ideal profiling
• Void-free soldering thanks to vacuum option for best possible results
• Gradient control
• No time lost with profiling
• Outstanding retraceability of all processes with wireless profiling system (WPS)

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In condensation reflow soldering with the CondensoX-Series, soldering is accomplished with the aid of a hot vapour as well as the medium Galden®. Since the heat transfer in condensation soldering is up to ten times higher than with convection soldering it is particularly suitable for handling large or high-mass boards. The use of a patented injection process and the flexible adjustment of temperatures and pressure allows the soldering procedure to be individually regulated. With the new CondensoXC Rehm increases its product range with a powerful system for laboratory applications, small lot sizes and prototyping.
An optional vacuum module ensures void-free soldering with all models of the CondensoXC – Series.

Features:

• Injection principle (repeatable control of the reflow profile)
• Hermetically sealed process chamber
• Controllable vacuum process – pre-vacuum and vacuum after soldering possible
• Manual loading from frontside
• No Galden® loss, active Galden® filtering
• Optional process monitoring (traceability) with the wireless WPS system

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The Rehm Thermal Systems vacuum soldering oven is exceptionally well suited for production facilities which pursue flux-free and void-free soldering in various inert gases (N2, H2, N2/H2 95/5).

The use of lead-free and lead-containing pastes and preforms with/without flux is also possible. Miniaturization in the fields of advanced packaging and semiconductors can be further developed by means of vacuum technology.

Features

• Oxide and void-free joint surface between chip and interconnected device
• Integrated or separate cleaning and de-scaling processes
• Simple profiling and fast heating and cooling rates
• Assembly under high level of vacuum
• Integration of drying and degassing processes
• Optimum dispersal of waste heat

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