The CondensoX series is based on a well-conceived design, in particular with regard to the hermetically sealed process chamber. Without moving the PCB during the process, the CondensoXP combines vacuum profiling and temperature profiling into a single system. Since the PCBs are not moved during the process, any shifting of the components is virtually ruled out. This, as well as outstanding temperature profiling, reduces failure rates and improves total cost of ownership.

In the case of the CondensoXP variant, the loading axis is laid out such that it’s suitable for hook up to an automated loading unit. The CondensoXP HS is equipped with a second loading axis for increased throughput. The process chamber can thus be reloaded while the workpiece carrier is being cooled down at the same time. This system is perfect for use in high-speed production lines.

Features

• Ideal for processing high-mass PCBs
• Smallest possible ΔT
• Extremely effective and homogenous heat transfer over the entire PCB
• Maximum soldering temperature limited by the medium’s boiling point
• A patented injection process assures reproducible soldering results and permits ideal profiling
• Void-free soldering thanks to vacuum option for best possible results
• Gradient control
• No time lost with profiling
• Outstanding retraceability of all processes with wireless profiling system (WPS)

The post Rehm | CondensoXP Vapor Soldering appeared first on ASI Technologies.

The CondensoX series is based on a well-conceived design, in particular with regard to the hermetically sealed process chamber. Without moving the PCB during the process, the CondensoXM combines vacuum profiling and temperature profiling into a single system. Since the PCBs are not moved during the process, any shifting of the components is virtually ruled out. This, as well as outstanding temperature profiling, reduces failure rates and improves total cost of ownership.The CondensoXM is equipped with an extended conveyor axis, and can thus be flexibly integrated into the existing workflow.

Features

• Ideal for processing high-mass PCBs
• Smallest possible Δ T
• Extremely effective and homogenous heat transfer over the entire PCB
• Maximum soldering temperature limited by the medium’s boiling point
• A patented injection process assures reproducible soldering results and permits ideal profiling
• Void-free soldering thanks to vacuum option for best possible results
• Gradient control
• No time lost with profiling
• Outstanding retraceability of all processes with wireless profiling system (WPS)

The post Rehm | CondensoXM appeared first on ASI Technologies.

In condensation reflow soldering with the CondensoX-Series, soldering is accomplished with the aid of a hot vapour as well as the medium Galden®. Since the heat transfer in condensation soldering is up to ten times higher than with convection soldering it is particularly suitable for handling large or high-mass boards. The use of a patented injection process and the flexible adjustment of temperatures and pressure allows the soldering procedure to be individually regulated. With the new CondensoXC Rehm increases its product range with a powerful system for laboratory applications, small lot sizes and prototyping.
An optional vacuum module ensures void-free soldering with all models of the CondensoXC – Series.

Features:

• Injection principle (repeatable control of the reflow profile)
• Hermetically sealed process chamber
• Controllable vacuum process – pre-vacuum and vacuum after soldering possible
• Manual loading from frontside
• No Galden® loss, active Galden® filtering
• Optional process monitoring (traceability) with the wireless WPS system

The post Rehm | CondensoXC Condensation Reflow Soldering appeared first on ASI Technologies.

מגוון רחב של מכונות מרמת הכניסה עד רמות הייצור הגבוהות ביותר, בעלות דיוק גבוהה. מערכות ההלחמה מחולקות לתנורים בהלחמה מסורתית סטנדרטית ותנורי הלחמה באדים.

הגמישות מבוקשת יותר מאי פעם בייצור אלקטרוניקה מודרני. תפיסת מערכת מודולרית מספקת רמות גמישות גבוהות בייצור. סוגי המערכות הכלולות באופציות של ה- VisionX נבדלות על ידי עיצובן המודולרי, והן זמינות באורכים שונים ועם גרסאות מסוע שונות.

בהתאם לתפוקה או למגוון המוצרים, העיצוב המודולרי חוסך זמן ומפחית עלויות מכיוון שהמערכת מותאמת באופן אידיאלי לייצור מוצרים ספציפיים ללקוח. ה- VisionXS מתאים במיוחד לייצור סדרות בגודל בינוני ועד סדרות גדולות.

צרו קשר למידע נוסף והזמנות.

The post תנור REFLOW – מערכת הלחמה מודולרית RHEM | VisionXS appeared first on ASI Technologies.

The VisionXP+ is our best-in-class convection reflow soldering system which is clearly in line with the trend towards dealing with natural resources in an environmentally sound fashion. The industry sector will have to do some rethinking – and machinery manufacturing won’t be able to ignore this development.

Rehm’s energy concept combines a top quality, sustainable production system with the requirements of modern manufacturing companies. Special emphasis was placed on energy-efficiency, reduced emissions and low operating costs during development of the VisionXP+.

With the help of the VisionXP+, our customers are verifiably able to reduce energy consumption by up to 20 % and produce 10 tons less CO2 per year on the average. A true energy wizard with outstanding performance.

Features:

• Process stability
• Environmentally aware management of resources
• Greatly reduced consumption of energy, nitrogen and coolant water in the standby mode
• Outside panel temperature of max. 15° C above room temperature
• Noise level reduction to less than 70 dB
• Full control thanks to monitoring of current, nitrogen and energy consumption for cooling
• Durable insulation for greatly reduced transfer of heat to the environment
• Minimal maintenance costs
• Efficient residue management
• Outstanding traceability through the use of numerous software tools

New! Individual Features: Vacuum Option

Energy-efficient, low maintenance and void-free – we offer innovative solutions for reflow soldering based on diverse options for the VisionXP+ system. A new vacuum model now permits convection soldering processes with partial vacuum – within a single process.

The VisionXP+ with vacuum option reliably removes pores, gas occlusions and voids immediately after the soldering process – while the solder is in an ideally molten state. Void rates of less than 2 % are made possible by vacuum of down to 2 mbar. Pressure and speed can be individually adjusted. This integrated solution results in a more time-efficient and stable production sequence. Time-consuming processing of the PCB in an external vacuum system is no longer necessary – the workpieces are transferred from the peak zones directly to the vacuum process.

• Vacuum after the soldering process for fewer voids
• Vacuum down to 2 mbar for reducing the number of voids in the solder joints
• Three-part conveyor: preheating and peak zone, vacuum module, cooling tract
• Infinitely adjustable, automatic advancing of the process chamber to the processing or the maintenance position
• Clean vacuum chamber thanks to two pyrolysis units and separate filtering of the depressurized atmosphere in the vacuum chamber
• Minimal downtime thanks to low maintenance
• Outstanding cooling performance, cooling time can be extended by means of synchronization

The post REHM | VisionXP+ Reflow Soldering System appeared first on ASI Technologies.

Features

• Stable process, even for lead-free soldering
• Optimized heat transfer and thermal stability
• Integrated residue management
• Lowest cost of ownership
• Minimal maintenance costs

Are you looking for a reliable all-round system and do you want to profit from optimized machine configurations? Or do you want a system which is also capable of processing small production work orders in an ideal fashion?

Rehm’s VisionXC convection reflow soldering systems are exceptionally well suited for the production of small lot sizes. The VisionXC Edition systems are available with time-tested standard equipment. This leaves nothing to be desired and offers great value for the money. The systems are available for use with nitrogen or air atmospheres.

The post REHM | VisionXC Reflow Soldering Systems appeared first on ASI Technologies.

The Rehm Thermal Systems vacuum soldering oven is exceptionally well suited for production facilities which pursue flux-free and void-free soldering in various inert gases (N2, H2, N2/H2 95/5).

The use of lead-free and lead-containing pastes and preforms with/without flux is also possible. Miniaturization in the fields of advanced packaging and semiconductors can be further developed by means of vacuum technology.

Features

• Oxide and void-free joint surface between chip and interconnected device
• Integrated or separate cleaning and de-scaling processes
• Simple profiling and fast heating and cooling rates
• Assembly under high level of vacuum
• Integration of drying and degassing processes
• Optimum dispersal of waste heat

The post Rehm | Nexus Vacuum Contact Soldering Oven appeared first on ASI Technologies.

The new Protecto coating system was developed to satisfy your demands for highest quality, stability and productivity for automatic in-line coating tasks.

Particular emphasis is placed on maintainability, intuitive program configuration and ultra-flexible equipment that can be adapted to customer requirements.

The patented Stream-Coat® nozzles measuring up to 100 mm long and only 2.4 mm thick enable a protective coating between tightly packed, tall components. This means expensive and time-consuming manual re-coating is a thing of the past.

Furthermore, different application methods such as dispensing, spraying or jetting can be achieved "on the fly", without changing the applicator and without splatters. Even areas under components can be coated using the connectible manifold cut-out on the Stream Coat® nozzles. The manifold cut-out does this by pushing the coating material under the component. Up to four different, selective coating tasks can be performed effortlessly with up to four coating applicators in multiple applications.

Features:

• Multifunctional coating application: jetting, dispensing and spraying
• Greatest possible process reliability
• Up to 4 heatable nozzles
• Highest coating accuracy
• All-in-one lacquering
• Selective coating
• Long-lasting fault-free lacquering
• Minimal maintenance required
• Also available as a production line concept consisting of a Protecto dispenser and RDS lacquer dryer
• Quick, intuitive programming with dependable software tools
• Flexible lacquering options thanks to multifunctional lacquer applicator

The post Rehm | Protecto XP Selective Conformal Coating Systems appeared first on ASI Technologies.

The upper surface of a plant’s leaves is its outermost defence, not only protecting it against pests and water loss, but also helping shake off dirt or increase resistance. This is a particularly well-known characteristic of the lotus flower – water just drips right off it. This was the biological inspiration behind innovative, self-cleaning surface coatings with what is known as the “lotus effect”.

The protective lacquer coating on electronic units acts in a similar way. It is now absolutely essential to protect sensitive components from aggressive environmental influences such as moisture, corrosion, chemicals, dust or vibration. High-selectivity conformal coating is the key to ensuring electronics work reliably and is indispensable in modern manufacturing.

Rehm has expanded its product range, introducing a compact, high-performance coating system to the market in ProtectoXC. Its low investment costs make it particularly appealing to electronics manufacturers who process low throughput. The device combines precise coating with a focus on what matters most: perfect protection for your electronics.

Features:

• Reliable coating process, even for low throughput
• Compact unit, easily integrated with batch or line production
• Modern software with touch operation and 3D trackball
• Barcode connectivity and optimum process documentation
• Low investment costs, top process performance
• Easy to maintain with its smart cleaning system

The post REHM | Protecto XC Protective Lacquer Coating appeared first on ASI Technologies.

Rehm Thermal Systems developed the Securo Plus system for the hot function test and Securo Minus for the cold function test. The systems operate in normal air or in nitrogen atmospheres.

To test the winter performance of sensitive electronics, functional modules are first cooled to temperatures of -45 °C. However, to simulate the installation environment in a vehicle, the modules are heated to +80 °C to +120 °C.

The Securo systems are highly compatible with other measuring equipment. This allows extensive function monitoring and secure quality control. The best analysis and documentation tools provide for transparent processes.

Features:

• Analysis of resistance of sensitive electronics in extreme temperatures
• Optimal combinations of systems with other measuring Equipment
• Excellent insulation values due to foamed housing
• Excellent heating or cooling capacity
• Sealed compressor for low noise Level
• Easy access and minimal maintenance
• Systems available as batch or in-line variant

The post Rhem | Securo Plus Heat and Cold Testing appeared first on ASI Technologies.