• נצר סרני, 7039500, ישראל

Rehm | CondensoXM

תיאור המוצר

Best possible soldering results with and without vacuum

The CondensoX series is based on a well-conceived design, in particular with regard to the hermetically sealed process chamber. Without moving the PCB during the process, the CondensoXM combines vacuum profiling and temperature profiling into a single system. Since the PCBs are not moved during the process, any shifting of the components is virtually ruled out. This, as well as outstanding temperature profiling, reduces failure rates and improves total cost of ownership.The CondensoXM is equipped with an extended conveyor axis, and can thus be flexibly integrated into the existing workflow.

Features

  • Ideal for processing high-mass PCBs
  • Smallest possible Δ T
  • Extremely effective and homogenous heat transfer over the entire PCB
  • Maximum soldering temperature limited by the medium’s boiling point
  • A patented injection process assures reproducible soldering results and permits ideal profiling
  • Void-free soldering thanks to vacuum option for best possible results
  • Gradient control
  • No time lost with profiling
  • Outstanding retraceability of all processes with wireless profiling system (WPS)

 

מידע נוסף

Manufacturer

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