תיאור המוצר
New open-valve mechanism achieves unrivaled vacuum power and start-up speed.
Two-stage trigger switch (PAT.P)
Step 1
Pulling the trigger (lightly) activates the first stage switch. The pump starts, and the air pressure decreases in the vacuum chamber.
Step 2
Next, pulling the trigger fully activates the second stage. The open-valve will open, and the solder is sucked up at once by the negative pressure in the vacuum chamber.
- 400% More Suction Capacity
- With open-valve mechanism
- Ceramic Heater with Internal Sensor
- A wide range for terminals, connectors and flat ICs
- Superior Temperature-Control Circuit
- To keep the temperature constant during desoldering
- Zero Volt Switch Circuit
- Reduces noise during heater ON/OFF
- Replaceable Cartridge Filter
- Makes changing the filter easy
- Vacuum pressure compared with other GOOT models
- The open-valve allows the device to reach vacuum pressure of -0.06MP (approx.-450mmHg) in only 0.1second. (About 4 times faster than our TP-200AS).