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Entry-level single point selective soldering system
Designed to meet the needs of the small/medium batch manufacturer who requires high levels of production flexibility, the Jade MKll entry-level system offers uncompromised selective soldering quality at a very low cost.
The Jade MKII is a hand load system, incorporating a universally adjustable tooling carrier capable of accommodating PCB’s or pallets up to 457 x 508mm.
Our patented Drop-Jet design fluxer offers quick and effective flushing of the pressurized flux chamber. This helps to keep maintenance levels to a minimum whilst enabling use of higher solid content fluxes as well as water-soluble fluxes.
As with all Pillarhouse systems, the soldering process is enhanced by a hot Nitrogen curtain which provides an inert atmosphere. This method of soldering also assists in the prevention of oxidization and provides a local preheat to the joint, thus reducing thermal shock to localized components.
The Jade MKII is controlled by a PC, through PillarCOMM, a Windows® based ‘Point & Click’ interface with PCB image display.
Standard Features
- Integral PC and machine mounted TFT monitor
- Inerted Nitrogen system
- Auto solder top-up (wire feed) & solder level detect
- Drop-Jet fluxer
- Set of AP style solder nozzle tips
- Internal fume extraction
- Colour programming camera
- Solder wave height measurement and correction
- Universally adjustable tooling carrier
- Thermal nozzle calibration system using integrated setting camera (requires manual correction)
- PillarCOMM Windows® based ‘Point & Click’ interface
- Multiple level password protection
- Manual fiducial correction
- Lead-free compatible
- Day-to-day service kit
Monitoring Options
- Flux presence sensor – thermistor style
- Flux spray, flow and spray & flow
- Pump rpm
- O2 ppm
- Nitrogen flow
System Options
- Top-side instant IR preheat
- Closed loop temperature control – via pyrometer or thermocouple
- Bottom-side IR ring heater
- Bottom-side hot Nitrogen selective preheat
- Automatic fiducial correction
- Ultrasonic fluxing
- Dual Drop-Jet / ultrasonic fluxing
- Laser PCB warp correction
- Micro nozzle assembly
- Solder reel identification
- Rapid change solder bath and pump system capability – does not include solder bath and pump
- Solder bath coding – identifies correct bath for program – only suitable for use with rapid change solder bath and pump system
- Encoders on X, Y and Z axis
- Larger PCB handling size
- Nitrogen generator
P/N 62212