• נצר סרני, 7039500, ישראל

Pillarhouse | Jade MKII, Single Point Selective Soldering System

תיאור המוצר

Entry-level single point selective soldering system

Designed to meet the needs of the small/medium batch manufacturer who requires high levels of production flexibility, the Jade MKll entry-level system offers uncompromised selective soldering quality at a very low cost.

The Jade MKII is a hand load system, incorporating a universally adjustable tooling carrier capable of accommodating PCB’s or pallets up to 457 x 508mm.

Our patented Drop-Jet design fluxer offers quick and effective flushing of the pressurized flux chamber. This helps to keep maintenance levels to a minimum whilst enabling use of higher solid content fluxes as well as water-soluble fluxes.

As with all Pillarhouse systems, the soldering process is enhanced by a hot Nitrogen curtain which provides an inert atmosphere. This method of soldering also assists in the prevention of oxidization and provides a local preheat to the joint, thus reducing thermal shock to localized components.

The Jade MKII is controlled by a PC, through PillarCOMM, a Windows® based ‘Point & Click’ interface with PCB image display.

Standard Features

  • Integral PC and machine mounted TFT monitor
  • Inerted Nitrogen system
  • Auto solder top-up (wire feed) & solder level detect
  • Drop-Jet fluxer
  • Set of AP style solder nozzle tips
  • Internal fume extraction
  • Colour programming camera
  • Solder wave height measurement and correction
  • Universally adjustable tooling carrier
  • Thermal nozzle calibration system using integrated setting camera (requires manual correction)
  • PillarCOMM Windows® based ‘Point & Click’ interface
  • Multiple level password protection
  • Manual fiducial correction
  • Lead-free compatible
  • Day-to-day service kit

Monitoring Options

  • Flux presence sensor – thermistor style
  • Flux spray, flow and spray & flow
  • Pump rpm
  • O2 ppm
  • Nitrogen flow

System Options

  • Top-side instant IR preheat
  • Closed loop temperature control – via pyrometer or thermocouple
  • Bottom-side IR ring heater
  • Bottom-side hot Nitrogen selective preheat
  • Automatic fiducial correction
  • Ultrasonic fluxing
  • Dual Drop-Jet / ultrasonic fluxing
  • Laser PCB warp correction
  • Micro nozzle assembly
  • Solder reel identification
  • Rapid change solder bath and pump system capability – does not include solder bath and pump
  • Solder bath coding – identifies correct bath for program – only suitable for use with rapid change solder bath and pump system
  • Encoders on X, Y and Z axis
  • Larger PCB handling size
  • Nitrogen generator

P/N 62212

מידע נוסף

Manufacturer

ספסיפיקציות

Height 1403mm – excluding light stack
Width 1000mm
Depth 1351mm
Board size 457mm x 508mm (larger PCB size available upon request)
Edge clearance Above / below 3mm
Height clearance Above / below 40mm nominal

Above 190mm – special application

Solder Most commonly used solder types – including lead-free
Solder pot capacity 8kg
Applicators AP style – 2.5mm to 16mm dia.
Extended AP style – 2.5mm to 20mm dia.
Micro nozzle – 1.5mm to 2.5mm
Jet-Tip style – 6mm to 20mm dia.
Jet-Wave nozzle – up to 25mm width
Special dedicated nozzles available upon request
Flux Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurized and inerted system, optional water soluble system available
X, Y & Z Axis resolution 0.1mm
Repeatability +/- 0.05mm
Nitrogen usage 35 litres gas/min. 5 bar pressure
Nitrogen purity 99.995% or better
Air supply pressure 5 bar / 72 psi
Power supplies Single phase + PE
Voltage 208V – 250V

 

Frequency 50/60Hz

 

Power 4kVA
Power with IR preheat 6.5kVA – Top-side
8kVA – Top with bottom-side ring heater
Transport Hand load
Tooling: Integral adjustable board guides, includes finger extensions and board clamps
Programming PillarCOMM Windows® based ‘Point & Click’ interface

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