The Cleanding Process consists of the Following Three Phases:
1. Cleaning process
To remove the contaminants these are first softened and then dissolved. An alkali process causes them to drop off from the surface as a gelatine-substance. The contaminants then drift down and build sediment on the bottom of the bath. In the case of an MPC-process the contaminants drift down as flakes.
To accelerate the cleaning process compressed air is blown into the bath.
2. Rinsing process
Rinsing by immersion in the second bath is important to achieve the optimum cleanliness.
For this purpose compressed air is blown into the bottom of the bath. When rinsing stencils the use of DI-water is recommended. When rinsing soldering frames then normal mains water can be used.
3. Drying process
The third chamber is designed with stacking room to enable drying with natural airflow.
The system has three chambers made of welded polypropylene plates.
All three chambers are equipped with solder frame separators and compressed-air piping.
The system also has a polypropylene cover. The frame of the system is made of welded steel profiles and is powder-coated. The system has compressed-air controllers and valves for individual draining of each bath.
The third chamber serves as a dryer. The effluents must be disposed of in accordance to the local authority laws as they normally contain Tin (Sn) and Lead (Pb) deriving from the oxides in the rests of the flux. Under normal conditions an interval of about one month between changing of the baths can be expected.
Remommended Chemicals for Cleaning:
Frames: ATRON SP200 (diluted with water - recommended concentration 20 %)Stencils: VIGON SC200 (diluted with water - recommended concentration 25 %)
(Cleaning chemicals are from the company Dr. O.K. Wack Chemie GmbH Germany)